Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
US6670719B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a microelectronic substrate having first and second device features, a conductive link that includes a conductive material extending between the first and second device features, and an external cover or enclosure disposed around at least a portion of the substrate and the conductive link. The package can be filled with a liquid or a pressurized gas to transfer heat away from the conductive link. In one embodiment, the enclosure can have a composition substantially identical to the composition of the conductive links and the enclosure can be formed simultaneously with formation of the conductive link to reduce the number of process steps required to form the microelectronic device package. A sacrificial material can temporarily support the conductive link during manufacture and can subsequently be removed to suspend at least a portion of the conductive link between two points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.