Mechanical transmission system for automatically breaking off in response to earthquake and method thereof
US6670889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.