Analytical constraint generation for cut-based global placement
US6671867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of designing the layout of an integrated circuit (IC) by deriving an analytical constraint for a cut-based placement partitioner using analytical optimization, and placing cells on the IC with the cut-based placement partitioner using the analytical constraint. Quadratic optimization may be used to determine a desired ratio of a cell area of a given partition to a total cell area (the balance parameter), and placing may be performed using multilevel bisection partitioning constrained by the balance parameter. This implementation may include a determination of an aspect ratio for an entire partitioning region of the integrated circuit, and a “center-of-mass” coordinate of the cells based on the quadratic optimization, which are then used to define a placement rectangle having the same aspect ratio, and centered on the center-of-mass coordinate. This placement rectangle is used to derive the balance parameter. The placement rectangle has a total area equal to a total moveable cell area, and the balance parameter is computed by calculating the ratio of a left portion of the placement rectangle which lies in the left partition to the total area of the placement rec…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.