Sample processing system
US6672358B2 · kind B2 · utility
13Cited by
47References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | May 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is to provide a processing system suitable for manufacturing an SOI substrate. A processing system includes a scalar robot for conveying a bonded substrate stack held by a robot hand, and a centering apparatus, separating apparatus, inverting apparatus, and cleaning/drying apparatus disposed at substantially equidistant positions from a driving shaft of the scalar robot. When the robot hand is pivoted about the driving shaft in the horizontal plane and moved close to or away from the driving shaft, a bonded substrate stack or separated substrate is conveyed among the processing apparatuses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.