Method for producing a reliable solder joint interconnection
US6672500B2 · kind B2 · utility
3Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Jun 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and an arrangement for measuring the cooling rate and temperature differential between the top and bottom surfaces of a printed circuit board. The method is intended to facilitate control over the temperature differential which is encountered between the top and bottom of the printed circuit board so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.