Lasable bond-ply materials for high density printed wiring boards
US6673190B2 · kind B2 · utility
13Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Nov 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/697
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.