Integrated device for microfluid thermoregulation, and manufacturing process thereof
US6673593B2 · kind B2 · utility
22Cited by
11References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Jan 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2443
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The integrated device for microfluid thermoregulation comprises a semiconductor material body having a surface; a plurality of buried channels extending in the semiconductor material body at a distance from the surface of the semiconductor material body; inlet and outlet ports extending from the surface of the semiconductor material body as far as the ends of the buried channels and being in fluid connection with the buried channels; and heating elements on the semiconductor material body. Temperature sensors are arranged between the heating elements above the surface of the semiconductor material body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.