Defect inspection method and apparatus therefor
US6674890B2 · kind B2 · utility
22Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2000 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Dec 11, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pattern inspection method and apparatus in which an image of a first pattern formed on a sample and an image of a second pattern formed on the sample is detected. At least one of the first pattern image and the second pattern image is converted to a gray level so as to be substantially the same with each other by linear combination including a gain and offset. A defect of the sample is detected by using the first pattern image and the second pattern image at least one of which has been converted to the gray level and a result of the detection is outputted to an external storage or processor by a communication arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.