Chie Shishido
82Patents
15h-index
89Co-inventors
87Inventor score
Filing activity: Jan 10, 1997 → Feb 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6587581B1 | Visual inspection method and apparatus therefor | Electricity | 86 | Expired |
| US6169282A | Defect inspection method and apparatus therefor | Physics | 55 | Expired |
| US6476388B1 | Scanning electron microscope having magnification switching control | Electricity | 51 | Expired |
| US6947587B1 | Defect inspection method and apparatus | Physics | 36 | Expired |
| US6865288B1 | Pattern inspection method and apparatus | Physics | 35 | Expired |
| US6087673A | Method of inspecting pattern and apparatus thereof | Physics | 31 | Expired |
| US6347150B1 | Method and system for inspecting a pattern | Physics | 27 | Expired |
| US6909930B2 | Method and system for monitoring a semiconductor device manufacturing process | Electricity | 24 | Expired |
| US7633061B2 | Method and apparatus for measuring pattern dimensions | Emerging Cross-Sectional Technologies | 23 | Active |
| US6674890B2 | Defect inspection method and apparatus therefor | Physics | 22 | Expired |
| US6614923B1 | Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof | Electricity | 22 | Expired |
| US6841403B2 | Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data | Electricity | 20 | Expired |
| US6898305B2 | Circuit pattern inspection method and apparatus | Physics | 19 | Expired |
| US7116816B2 | Method of inspecting a pattern and an apparatus thereof and a method of processing a specimen | Electricity | 19 | Expired |
| US6797526B2 | Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data | Electricity | 15 | Expired |
| US6929892B2 | Method of monitoring an exposure process | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6913861B2 | Method of observing exposure condition for exposing semiconductor device and its apparatus and method of manufacturing semiconductor device | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5763123A | Method for producing thin-film substrate | Electricity | 12 | Expired |
| US7269280B2 | Method and its apparatus for inspecting a pattern | Physics | 12 | Expired |
| US8107717B2 | Defect inspection method and apparatus | Physics | 11 | Active |
| US7732761B2 | Method for measuring a pattern dimension using a scanning electron microscope | Electricity | 11 | Active |
| US6831998B1 | Inspection system for circuit patterns and a method thereof | Physics | 10 | Expired |
| US7685560B2 | Method and apparatus for monitoring exposure process | Physics | 10 | Active |
| US6756589B1 | Method for observing specimen and device therefor | Electricity | 10 | Expired |
| US7269287B2 | Method and apparatus for measuring dimension using electron microscope | Physics | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.