Pick-up tool
US6675465B2 · kind B2 · utility
3Cited by
3References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Oct 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pick-up tool for the mounting of semiconductor chips onto a substrate has a suction device which consists of a plate made out of a dimensionally stable material one surface of which has structures made of hardened adhesive. The material for the plate is, for example, aluminum, a carbon fiber composite material or a dimensionally stable plastic. A suitable material for the structure is, for example, an adhesive which has Teflon® as the filing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.