Solder paste stenciling apparatus for minimizing residue of solder paste
US6675704B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Mar 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/104
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder paste stenciling apparatus for minimizing residue of solder paste includes a stencil having multiple stencil openings defined therein, a supporting member retaining the stencil, and a vibrator for vibrating the stencil. In operation, a substrate is engaged to a bottom surface of the stencil, and solder paste is applied onto a top surface of the stencil so that the stencil openings are filled with the solder paste. The substrate is then slowly separated from the stencil while the vibrator vibrates the stencil to evacuate the solder paste out of the stencil openings and to further deposit on the substrate. Hence, the amount of residual solder paste adhered to inner surfaces defining the stencil openings is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.