Method of manufacturing a microelectromechanical switch
US6678943B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2000 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Dec 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for controlling the flow of signals by selectively switching signals to ground and allowing signals to pass through a signal line based a position of a conductive pad. The method includes the steps of forming a conductive coplanar signal line and ground planes, depositing a first release layer over the signal line and ground planes, and forming a conductive pad spanning portions of both the signal line and ground planes on the first release layer. The method also includes the steps of forming a second release layer over the conductive pad, forming two sets of holes through the first and second release layers down to the ground planes with the two sets of holes being formed around portions of the conductive path, and forming a dielectric suspension in a first set of the two sets of holes. The method further includes the steps of forming a metal contact on the dielectric suspension, forming a metal bracket in the second set of the two sets of holes, and removing the first and second release layers to release the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.