Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
US6679765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus. The slurry supply system includes a wafer carrier configured to hold a semiconductor wafer to be polished; a supporting arm to support the wafer carrier; a slurry supplier connected to the supporting arm and located on the front edge of the rotating direction of the rotating platen so that the slurry supplier is positioned opposite the wafer carrier; and a plurality of openings formed on the slurry supplier to feed chemical mechanical polishing fluids, each of the openings individually supplied with individual control of the chemical mechanical polishing fluids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.