Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package
US6680220B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | May 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; a resin encapsulant; and a mark member. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. The mark member is embedded in the upper surface of the resin encapsulant. The mark member, which is transferred from a transfer sheet in a single process step, is highly visible and can be formed efficiently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.