Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
US6680241B2 · kind B2 · utility
17Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2000 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Dec 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfaces of each chip bonded to the first wafer sheet are covered with a reinforcing thin film. Each of the plurality of chips is removed from the first wafer sheet. The flexural strength of a chip can be suppressed from being lowered by chipping and chip cracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.