Methanol-containing silica-based CMP compositions
US6682575B2 · kind B2 · utility
2Cited by
20References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 5, 2002 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a polishing composition comprising (a) a silica abrasive, (b) methanol, and (c) a liquid carrier, wherein the polishing composition has a pH of about 1 to about 6, and the polishing composition is colloidally stable. The invention also provides a method for polishing a substrate comprising a silicon-based dielectric layer using the polishing composition. The invention further provides a method of stabilizing a silica abrasive in a polishing composition by contacting the abrasive with methanol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.