Etching and cleaning methods and etching and cleaning apparatus used therefor
US6683007B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2000 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An etching/cleaning method makes it possible to effectively remove unnecessary materials on a semiconductor wafer, having a surface peripheral area and a surface device area, without damaging the device area. The semiconductor is rotated in a horizontal plane while an etching/cleaning liquid is emitted by an edge nozzle toward the surface peripheral area, thereby selectively etching an unnecessary material in the surface peripheral area. The etching/cleaning liquid emitted from the edge nozzle preferably has an emission direction oriented along a rotation direction of the wafer or outward with respect to a tangent of the wafer formed near a contact point of the liquid with the surface peripheral area of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.