High frequency module having a laminate board with a plurality of dielectric layers
US6683512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Jun 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high frequency module according to the present invention comprises a laminate board having a plurality of dielectric layers (11 to 18) stacked one on another, a branch filter circuit (DIP10) for separating a plurality of transceiver systems from each other, switch circuits (SW10, SW20) for switching the respective transceiver systems between transmitter branches (TX) and receiver branches (RX), power amplifiers (AMP10, AMP20) each comprising a matching circuit (MAT10, MAT20) and a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches (TX), and couplers (COP10, COP20) for monitoring outputs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.