Patent · US Expired

Surface acoustic wave component

US6685168B1 · kind B1 · utility

14Cited by

6References

7Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Alois Stelzl · Munich, DE
Hans Kruger · Birkenfeld, DE
Karl Weidner · Birkenfeld, DE
Manfred Wossler · Munich, DE

Key dates

Filing date	Dec 22, 2000
Grant date	Feb 3, 2004
Priority date	—
Expiry date	Dec 22, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/42
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.