Polishing pad window for a chemical mechanical polishing tool
US6685537B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2000 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Aug 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is an apparatus and method for manufacturing a window into a polishing pad used during a planarization process of a front surface of a wafer. A hole is created in the polishing pad at a location where a window is desired. A first release film may be pressed against the working surface of the polishing pad thereby covering one end of the hole. Window material of suitable mechanical, chemical and optical properties is cast in the hole. A second release film may also be pressed against the bottom surface of the polishing pad covering the other end of the hole. The window material is preferably cured with light to quickly form and bond the window into the hole. The release films may be removed leaving the cast window in the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.