Method for enhancing the uniformity of electrodeposition or electroetching
US6685814B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Jun 4, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/008
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for an electrodeposition or electroetching system. A thin metal film is deposited or etched by electrical current through an electrolytic bath flowing toward and in contact with a target on which the film is disposed. Uniformity of deposition or etching is promoted, particularly at the edge of the target film, by, baffle and shield members through which the bath passes as it flows toward the target. The baffle has a plurality of openings disposed to control the localized current flow across the cross section of the workpiece/wafer. Disposed near the edge of the target, the shield member shapes the potential field and the current line so that it is uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.