John O. Dukovic
24Patents
14h-index
57Co-inventors
84Inventor score
Filing activity: Feb 14, 1992 → Feb 9, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5516412A | Vertical paddle plating cell | Emerging Cross-Sectional Technologies | 222 | Expired |
| US6126798A | Electroplating anode including membrane partition system and method of preventing passivation of same | Chemistry; Metallurgy | 205 | Expired |
| US6159354A | Electric potential shaping method for electroplating | Chemistry; Metallurgy | 146 | Expired |
| US5522975A | Electroplating workpiece fixture | Chemistry; Metallurgy | 84 | Expired |
| US5312532A | Multi-compartment eletroplating system | Emerging Cross-Sectional Technologies | 84 | Expired |
| US6569299B1 | Membrane partition system for plating of wafers | Chemistry; Metallurgy | 80 | Expired |
| US6193859A | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Chemistry; Metallurgy | 74 | Expired |
| US6709562B1 | Method of making electroplated interconnection structures on integrated circuit chips | Electricity | 44 | Expired |
| US6261426A | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching | Chemistry; Metallurgy | 37 | Expired |
| US7214297B2 | Substrate support element for an electrochemical plating cell | Chemistry; Metallurgy | 28 | Expired |
| US5352350A | Method for controlling chemical species concentration | Performing Operations; Transporting | 28 | Expired |
| US6471845B1 | Method of controlling chemical bath composition in a manufacturing environment | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6685814B2 | Method for enhancing the uniformity of electrodeposition or electroetching | Chemistry; Metallurgy | 18 | Expired |
| US7704352B2 | High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate | Emerging Cross-Sectional Technologies | 17 | Active |
| US6946716B2 | Electroplated interconnection structures on integrated circuit chips | Electricity | 11 | Expired |
| US6251251A | Anode design for semiconductor deposition | Chemistry; Metallurgy | 11 | Expired |
| US7504335B2 | Grafted seed layer for electrochemical plating | Electricity | 1 | Active |
| US11815816B2 | Apparatus for post exposure bake of photoresist | Electricity | 1 | Active |
| US7736928B2 | Precision printing electroplating through plating mask on a solar cell substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US11798606B2 | Additive patterning of semiconductor film stacks | Electricity | 0 | Active |
| US7820472B2 | Method of forming front contacts to a silicon solar cell without patterning | Emerging Cross-Sectional Technologies | 0 | Active |
| US11018223B2 | Methods for forming device isolation for semiconductor applications | Electricity | 0 | Active |
| US11934103B2 | Apparatus for post exposure bake of photoresist | Electricity | 0 | Active |
| US11049537B2 | Additive patterning of semiconductor film stacks | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.