Method for producing a semiconductor device
US6686107B2 · kind B2 · utility
10Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Nov 18, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7084
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A relative positional error is caused between an alignment mark and a device area on a mask due to an error inherent to the mask drawing apparatus, which causes an alignment error in the device area even when alignment upon exposure has no problem. Then, according to this invention, a relative positional error between the alignment mark and the device area on the mask is measured in an off line manner, the result of measurement is set upon exposure as a correction value to an exposure device thereby correcting the mask drawing error to reduce alignment errors in the device area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.