Patent · US Expired

Method for design and manufacture of semiconductors

US6686253B2 · kind B2 · utility

255Cited by
53References
39Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 11, 2001
Grant dateFeb 3, 2004
Priority date
Expiry dateJul 31, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2115/10
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

This invention discloses a method for designing and manufacturing semiconductors including the steps of: (i) producing a fab-ready design for a semiconductor device by importing into the design at least one core from a remote source, the core bearing an identification indicium, (ii) utilizing the fab-ready design to fabricate the semiconductor device, and (iii) reading the identification indicium from the semiconductor device to indicate incorporation of the at least one core therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.