Methods of fixturing flexible substrates and methods of processing flexible substrates
US6687969B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 1997 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to methods of fixturing and processing flexible circuit substrates. Flexible circuit substrates are removably coupled with a processing carrier in certain aspects of the invention. Such coupling is preferably void of any adhesive. According to preferred embodiments of the present invention, the coupling surface is configured for reuse and a second flexible circuit substrate is positioned upon the coupling surface following the removal of the first flexible circuit substrate therefrom. Ideally, the coupling surface remains upon the processing carrier during the separation of a flexible circuit substrate from the coupling surface. One disclosed method of fixturing a flexible circuit substrate comprises: providing a processing carrier having a coupling surface, the coupling surface comprising silicone; positioning a flexible circuit substrate upon the coupling surface; and separating the flexible circuit substrate and the coupling surface while maintaining the coupling surface upon the processing carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.