Optimized metal fuse process
US6687973B2 · kind B2 · utility
4Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jul 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal fuse process that uses a thinner (e.g., 6000 å) oxide (108) over the top interconnect (102). The oxide (108) is removed over the probe pads (106) for testing but is not removed over the fuses (104). Because the oxide (108) is thin at the upper corners of the fuse (104), the oxide (108) cracks over the fuse (104) during a laser pulse (114). A wet etch is then used to dissolve the exposed fuses (104).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.