Apparatus for processing flexible tape for microelectronic assemblies
US6687980B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.