Method for forming pin-form wires and the like
US6687988B1 · kind B1 · utility
111Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
So as to form pin-form wires or bumps in wire bonding for, for instance, semiconductor devices, the length of a wire (or the tail length) extending from the lower end of a capillary is set longer than the wire length required for forming the ball that is formed in the next step, then the ball is formed on the tip end of the wire, notches are formed in the wire located between the ball and the capillary by a pair of cutters, the ball is bonded to, for instance, an electrode pad, and then the wire is pulled away from the electrode pad so as to cut the wire from the area where the notches are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.