Parallel plate development with multiple holes in top plate for control of developer flow and pressure
US6688784B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Apr 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.