Sealable surface method and device
US6689222B2 · kind B2 · utility
4Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jul 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides such an improved metallic surface for sealable mating to a seal device such as a gasket. In one embodiment, it provides a sealable apparatus that has a component and a seal device. The component has a seal contact area for receiving the seal device. The seal contact area comprises a metallic surface with randomly distributed micro-pits that are capable of sealably mating with the seal device when the seal contact area is operably mated to the seal device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.