Patent · US Expired

Probe and method of manufacturing mounted AFM probes

US6690008B2 · kind B2 · utility

18Cited by

15References

24Claims

0Family size

Assignee

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE

Inventors

Thomas Hantschel · Houtvenne, BE
Wilfried Vandervorst · Mechelen, BE

Key dates

Filing date	Sep 14, 2001
Grant date	Feb 10, 2004
Priority date	—
Expiry date	Sep 14, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/873
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An atomic force microscopy (AFM) probe and a method of manufacturing mounted probes for AFM applications. The method implements an optimized soldering procedure for mounting a probe to a holder chip. In one embodiment, a metallisation system of Ti:W+Ni+Au is applied with a SnBi58 solder paste in combination with a hotplate. The mechanical connection between the probe and holder chip is preferably rigid. The soldered probe is highly conductive and the probe-holder chip assembly shows clear resonance peaks in tapping mode AFM.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.