Patent · US Expired

Stitched circuits larger than the maximum reticle size in sub-micron process

US6690076B1 · kind B1 · utility

6Cited by
7References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 10, 2000
Grant dateFeb 10, 2004
Priority date
Expiry dateMar 10, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S257/909

Abstract

A circuit having a plurality of circuit blocks formed on a semiconductor substrate is disclosed. The circuit blocks are stitched together by appropriately connecting input and output lines of the plurality of circuit blocks. The circuit also includes connecting circuits coupled to the plurality of circuit blocks. The connecting circuits provide low voltage drop across boundaries where the plurality of circuit blocks are stitched together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.