Methods for retaining assembled components
US6691407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel formed in said adhesive body such that the coupling member is engaged with at least one engaging member, said at least one engaging member each extending into said channel from an internal surface defining said channel. The component is then assembled onto a printed circuit board and adhered onto the printed circuit board via the adhesive body when the adhesive body is in semi-liquid state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.