Pb-free soldering alloy
US6692691B2 · kind B2 · utility
4Cited by
3References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Jul 19, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.