Method for filling fine hole
US6693049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70341
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for filling a fine hole, having a hole pattern diameter of less than or equal to 0.18 &mgr;m including steps of: (i) filling the fine hole with filler which is obtained by dissolving into an organic solvent a nitrogen-containing compound having mean molecular weight of less than or equal to 800 and containing at least one compound selected from melamine, benzoguanamine, acetoguanamine, glycol-uril, urea, thiourea, guanidine, alkyleneurea and succinylamide, in which hydrogen atoms of amino groups are substituted by at least one hydroxyalkyl group or an alkoxyalkyl groups or both hydroxyalkyl and alkoxyalkyl groups; (ii) drying the filler; and (iii) heating the filler at a temperature of 150-250° C., whereby no bubbles are generated when the fine hole is filled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.