Apparatus for testing reliability of interconnection in integrated circuit
US6693446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In the present invention, an apparatus of testing leakage current protection reliability of an integrated circuit interconnection. The apparatus has at least one comb-like pattern composed of a length portion, multiple tooth portions which are connected orthogonally to the length portion, and vias which are formed vertically from the ends of the tooth portions, respectively, through an interlayer dielectric layer. Additionally the apparatus has a serpentine-like pattern including a length parallel part or a connection part which is running parallel to the length portion, a tooth parallel part which is parallel to the tooth portion and formed at a level different from the level of the connection part or the length parallel part, and vias connecting them. The via of the comb-like pattern is located at the central position between the neighboring two vias of the serpentine-like pattern. The apparatus also has pads for applying a defined bias voltage to the comb-like pattern and the serpentine-like pattern to generate a potential difference between the two patterns. Thus, as multiple weak field regions are formed at the region where the vias are positioned, it is possible to find a fai…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.