High rate optical correlator implemented on a substrate
US6693712B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Dec 16, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06E3/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A high rate optical correlator is implemented on a substrate in which all of the optical devices are referenced to the flat surface of the substrate for optical alignment purposes by mounting the devices thereon. With the substrate surface as a reference point, alignment of the optical pieces is achieved to within a wavelength to eliminate the possibility of a “no correlation” result due to optical misalignment of the optical pieces. Additionally for the active elements, namely the laser, detector and spatial light modulators, interconnection of these devices and to drive sources is accomplished via direct coupling through the substrate so that the devices can communicate with each other through the silicon, thus to eliminate wire bonding and reduce pin count for the approximate 100,000 optical interconnects for a 256/256 array. Moreover, an epoxy frame which is milled at its top surface is used to mount an optical element over an active element for the alignment thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.