Inventor · Nashua, NH, US

John Trezza

108Patents
23h-index
21Co-inventors
90Inventor score

Filing activity: Jan 3, 1997 → Jul 31, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US7803693B2 Bowed wafer hybridization compensation Electricity 198 Active
US7521806B2 Chip spanning connection Electricity 188 Expired
US7157372B1 Coaxial through chip connection Electricity 98 Expired
US7482272B2 Through chip connection Electricity 53 Active
US7534722B2 Back-to-front via process Electricity 49 Active
US6527456B1 Cluster integration approach to optical transceiver arrays and fiber bundles Physics 48 Expired
US6567963B1 Wafer scale integration and remoted subsystems using opto-electronic transceivers Physics 48 Expired
US7786592B2 Chip capacitive coupling Electricity 47 Active
US6344664B1 Electro-optical transceiver system with controlled lateral leakage and method of making it Electricity 46 Expired
US6945701B2 Multi-piece fiber optic component and manufacturing technique Physics 44 Expired
US5909303A Optical modulator and optical modulator array Physics 43 Expired
US7538033B2 Post-attachment chip-to-chip connection Electricity 40 Expired
US8860083B1 Low noise hybridized detector using charge transfer Electricity 40 Active
US7808111B2 Processed wafer via Emerging Cross-Sectional Technologies 39 Active
US8283778B2 Thermally balanced via Emerging Cross-Sectional Technologies 35 Active
US7215032B2 Triaxial through-chip connection Emerging Cross-Sectional Technologies 35 Expired
US7659202B2 Triaxial through-chip connection Emerging Cross-Sectional Technologies 34 Active
US8093729B2 Electrically conductive interconnect system and method Emerging Cross-Sectional Technologies 32 Active
US6485993B2 Method of making opto-electronic devices using sacrificial devices Electricity 32 Expired
US6316286A Method of equalizing device heights on a chip Electricity 30 Expired
US7946331B2 Pin-type chip tooling Electricity 28 Active
US6434308B1 Optoelectronic connector system Electricity 25 Expired
US7687397B2 Front-end processed wafer having through-chip connections Performing Operations; Transporting 23 Active
US7598163B2 Post-seed deposition process Electricity 23 Active
US6775308B2 Multi-wavelength semiconductor laser arrays and applications thereof Electricity 23 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.