Thermoelectrically cooling electronic devices
US6696635B2 · kind B2 · utility
22Cited by
3References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Mar 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.