Miniaturized image sensor
US6696738B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second boards, which are located at different heights. The frame layer has an upper surface and a lower surface. The frame layer covers and seals the metal sheets while exposes bottom surfaces of the second boards. The frame layer is formed with a chamber. Bottom surfaces of the first boards are exposed through the chamber, and a transparent region communicating with the chamber is formed on the upper surface of the frame layer. The photosensitive chip formed with bonding pads is disposed within the chamber. The bonding pads contact the bottom surfaces of the first boards. The transparent layer is mounted on the frame layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.