KINGPAK TECHNOLOGY INC.
81Patents
43Active
81Granted
46Portfolio score
Filing activity: Jan 23, 2001 → Sep 30, 2020 · 8 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6400007B1 | Stacked structure of semiconductor means and method for manufacturing the same | Electricity | 65 | Expired |
| US6472736B1 | Stacked structure for memory chips | Electricity | 33 | Expired |
| US6521881B2 | Stacked structure of an image sensor and method for manufacturing the same | Electricity | 24 | Expired |
| US6680525B1 | Stacked structure of an image sensor | Electricity | 21 | Expired |
| US8481343B2 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Electricity | 18 | Active |
| US6590269B1 | Package structure for a photosensitive chip | Electricity | 18 | Expired |
| US6646316B2 | Package structure of an image sensor and packaging | Electricity | 15 | Expired |
| US6696738B1 | Miniaturized image sensor | Electricity | 15 | Expired |
| US6649834B1 | Injection molded image sensor and a method for manufacturing the same | Electricity | 13 | Expired |
| US7015586B2 | Stacked structure of integrated circuits | Electricity | 13 | Expired |
| US6642137B2 | Method for manufacturing a package structure of integrated circuits | Electricity | 11 | Expired |
| US6876544B2 | Image sensor module and method for manufacturing the same | Electricity | 10 | Expired |
| US8969120B2 | Two-stage packaging method of image sensors | Electricity | 10 | Active |
| US6870208B1 | Image sensor module | Electricity | 10 | Expired |
| US7423334B2 | Image sensor module with a protection layer and a method for manufacturing the same | Electricity | 10 | Active |
| US6747261B1 | Image sensor having shortened wires | Electricity | 8 | Expired |
| US6874227B2 | Method for packaging an image sensor | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7554599B2 | Image sensor module with air escape hole and a method for manufacturing the same | Electricity | 8 | Active |
| US6753203B1 | Method for manufacturing an image sensor | Electricity | 6 | Expired |
| US8563350B2 | Wafer level image sensor packaging structure and manufacturing method for the same | Electricity | 6 | Active |
| US6940058B2 | Injection molded image sensor module | Electricity | 6 | Expired |
| US7598580B1 | Image sensor module package structure with supporting element | Electricity | 6 | Active |
| US7196322B1 | Image sensor package | Electricity | 5 | Expired |
| US8390087B2 | Image sensor package structure with large air cavity | Electricity | 5 | Active |
| US8440488B2 | Manufacturing method and structure for wafer level image sensor module with fixed focal length | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.