Interconnect structures and a method of electroless introduction of interconnect structures
US6696758B2 · kind B2 · utility
28Cited by
19References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Nov 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.