Apparatus for removing wafer ring tape
US6698486B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Jul 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for removing a wafer ring tape, on which defective chips remain, from a wafer ring after normal chips are detached from the wafer ring tape, is provided. The apparatus comprises a ring table for supporting a tape-adhered wafer ring in which the wafer ring tape is attached to the wafer ring; a detaching head positionable above the ring table and movable for detaching the wafer ring tape from the wafer ring; a blocking pin disposed under the ring table to support the wafer ring tape detached from the wafer ring; and a pair of compressing plates disposed under the ring table to compress the wafer ring tape supported by the blocking pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.