Room temperature gold wire bonding
US6698646B2 · kind B2 · utility
8Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Sep 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20306
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.