Wafer splitting method using cleavage
US6699774B2 · kind B2 · utility
10Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Nov 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Notches are formed in a surface of a wafer on which semiconductor elements have been formed. Then, a surface protection tape is stuck to the element-formed surface of the wafer. Subsequently, the wafer is cleaved along a crystal orientation using the notches as starting points. Finally, a back surface of the wafer is ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.