Shinya Takyu
26Patents
10h-index
24Co-inventors
71Inventor score
Filing activity: Apr 24, 1998 → Mar 13, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5888883A | Method of dividing a wafer and method of manufacturing a semiconductor device | Electricity | 121 | Expired |
| US6294439A | Method of dividing a wafer and method of manufacturing a semiconductor device | Emerging Cross-Sectional Technologies | 93 | Expired |
| US6184109A | Method of dividing a wafer and method of manufacturing a semiconductor device | Emerging Cross-Sectional Technologies | 40 | Expired |
| US7060593B2 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6465330B1 | Method for grinding a wafer back | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6337258B1 | Method of dividing a wafer | Electricity | 29 | Expired |
| US7135384B2 | Semiconductor wafer dividing method and apparatus | Electricity | 23 | Expired |
| US6756562B1 | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method | Electricity | 16 | Expired |
| US7285864B2 | Stack MCP | Electricity | 13 | Expired |
| US6774011B2 | Chip pickup device and method of manufacturing semiconductor device | Electricity | 13 | Expired |
| US6699774B2 | Wafer splitting method using cleavage | Electricity | 10 | Expired |
| US6777313B2 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Electricity | 8 | Expired |
| US6838316B2 | Semiconductor device manufacturing method using ultrasonic flip chip bonding technique | Electricity | 8 | Expired |
| US7060532B2 | Manufacturing method of semiconductor device | Electricity | 8 | Expired |
| US7223319B2 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7932162B2 | Method for manufacturing a stacked semiconductor package, and stacked semiconductor package | Electricity | 5 | Active |
| US7482695B2 | Stack MCP and manufacturing method thereof | Electricity | 5 | Active |
| US8294282B2 | Semiconductor device and adhesive sheet | Electricity | 2 | Active |
| US8771456B2 | Method of manufacturing a semiconductor device and substrate separating apparatus | Emerging Cross-Sectional Technologies | 2 | Active |
| US8790995B2 | Processing method and processing device of semiconductor wafer, and semiconductor wafer | Electricity | 2 | Active |
| US7300818B2 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US8956917B2 | Semiconductor device, and manufacturing method and manufacturing apparatus of the same | Electricity | 1 | Active |
| US7631680B2 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9893116B2 | Manufacturing method of electronic device and manufacturing method of semiconductor device | Electricity | 0 | Active |
| US7294558B2 | Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.