Modular semiconductor die package and method of manufacturing thereof
US6700138B2 · kind B2 · utility
13Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Apr 5, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4286
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.