Resin for semiconductor wire
US6700198B2 · kind B2 · utility
6Cited by
9References
1Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 5, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Oct 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.