Impedance compensation for circuit board breakout region
US6700457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Jul 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the packaged chip having a package, wherein the circuit board trace is connected to the package in a circuit board breakout region, and wherein the circuit board trace includes a fan-out trace section having an impedance Zo1, a matching region trace section having an impedance Zo2, and a package trace compensation section having an impedance Zo3, wherein an effective impedance of the matching region trace section and the package trace compensation section is approximately equal to impedance Zo1, where Zo3<Zo1<Zo2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.