Pressure transducer employing on-chip resistor compensation
US6700473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2000 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A dielectrically isolated temperature compensated pressure transducer including: a wafer including a deflectable diaphragm formed therein, the diaphragm being capable of deflecting in response to an applied pressure, and the diaphragm defining an active region surrounded by an inactive region of the wafer; a plurality of dielectrically isolated piezoresistive elements formed on the active region of the wafer and coupled together to form a Wheatstone bridge configuration so as to cooperatively provide an output signal in response to and indicative of an amount of deflection of the diaphragm, the plurality of piezoresistive elements being undesirably operative to introduce an undesirable error into the output according to exposure of the wafer to an environmental condition; and, a dielectrically isolated resistor formed on the inactive region of the wafer and electrically coupled in series to the plurality of piezoresistive elements so as to at least partially compensate for the undesirable error.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.